以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
Москвичей предупредили о резком похолодании09:45，推荐阅读雷电模拟器官方版本下载获取更多信息
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The public inquiry into the Covid pandemic has cost the government more than £100m to respond to so far, the BBC has learnt. This is on top of the £192m spent by the inquiry itself - meaning the cost to the taxpayer is over 50% more than previously thought.，详情可参考旺商聊官方下载